LOCTITE 315 / SF 7386 KIT is a two component adhesive system combining a self shimming thermally conductive acrylic adhesive (LOCTITE 315) with its dedicated activator (SF 7386). It bonds heat generating electronic components to heat sinks with consistent insulation and controlled cure.
This adhesive kit is engineered for high-reliability electronic assemblies where effective heat dissipation and serviceable bond performance are critical. The LOCTITE 315 paste self shims a precise gap (approx. 0.12–0.15 mm) between component and heat sink, providing both electrical insulation and thermal transfer. The SF 7386 activator triggers cure quickly upon contact, reducing fixture time to minutes and leading to structural strength within 24 72 hours. This kit simplifies thermal interface bonding, supports maintenance and repair by enabling reworkable joints, and ensures consistent performance across batches and environments in power electronics and PCB manufacturing.
Adhesive specific gravity @ 25 °C: ~1.66; Activator specific gravity: ~0.80
Adhesive viscosity: 360 000–850 000 mPa·s; Activator viscosity: ~1–2 mPa·s
Thermal conductivity: ~0.808 W/m·K
Dielectric breakdown strength: ~26.7 kV/mm
Shear strength on steel within 72 hours: ≥ 6.9 N/mm²
Typical insulating gap: 0.12–0.15 mm
Activator remains active on surfaces for up to 6 hours
High flammability (flash point ~ –4 °C) — handle with care and meet storage requirements
Primary Chemistry:
Modified acrylic adhesive plus substituted dihydropyridine activator
Prevents thermal damage by ensuring efficient heat transfer from components to heat sinks
Eliminates uneven thermal interface gaps that reduce performance
Allows re serviceable installations while maintaining high bond strength
Streamlines adhesive dispensing and fixture in manufacturing or field environments
Apply LOCTITE 315 adhesive to component or heat sink as a paste layer.
Apply LOCTITE SF 7386 activator to the mating surface and assemble parts promptly within 15 seconds.
Allow full cure for up to 72 hours before service or loading.
Suitable for bonding devices such as transformers, power transistors and other heat-generating modules to metal heatsinks.
No mixing required; activator controls cure without affecting adhesive chemistry.
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